Event Title

Development of an Anodized Aluminum Interposer for the test socket industry

Location

Buller Hall

Start Date

2-26-2016 2:30 PM

End Date

2-26-2016 4:00 PM

Description

Anodized Aluminum is being considered for use as an interposer to position (helical springs) pins to analyze the connectivity of the printed circuit board. Pieces of aluminum alloy 6061 were anodized to create a thin oxide layer. The thickness of the oxide layer and the resistivity were measured. The results suggest that aluminum is a potential candidate to be used to spearhead the next generation of interposer with better control of the dimensional accuracy of these test sockets.

Acknowledgments

Dr. Boon-Chai Ng

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Feb 26th, 2:30 PM Feb 26th, 4:00 PM

Development of an Anodized Aluminum Interposer for the test socket industry

Buller Hall

Anodized Aluminum is being considered for use as an interposer to position (helical springs) pins to analyze the connectivity of the printed circuit board. Pieces of aluminum alloy 6061 were anodized to create a thin oxide layer. The thickness of the oxide layer and the resistivity were measured. The results suggest that aluminum is a potential candidate to be used to spearhead the next generation of interposer with better control of the dimensional accuracy of these test sockets.