Oral Breakout Sessions

Presentation Title

C-4 Evaluation of anodized aluminum for potential use as an interposer for the test socket industry

Presenter Status

Professor, Department of Engineering and Computer Science

Second Presenter Status

Research Assistant, Department of Engineering and Computer Science

Third Presenter Status

Student

Fourth Presenter Status

Student

Preferred Session

Oral Session

Start Date

30-10-2015 3:45 PM

End Date

30-10-2015 4:00 PM

Presentation Abstract

Interposers are used to position (helical springs) pins used to analyze the connectivity of the printed circuit board. The interlocking plates are made of polymers, an electric insulator to prevent the short circuiting of the electronics as well as for ease of manufacturability. But the dimensional accuracy of these polymers may be hampered by the increase in temperature during operation. A new material that has the ease of manufacturability and is a good insulator, but will not be hampered by the increase in temperature, is desired. Aluminum with its surface coated with an oxide layer (aluminum oxide) would fulfill this criterion.

Pieces of aluminum alloy 6061, (~1 inch x 1 inch) with fine holes (0.5 mm or less) drilled into the thin sheet (0.01 in) were anodized in the lab. The resistance of these anodized material measured were very high (overload) and an oxide thickness of ~4 microns was determined using the scanning electron microscope.

This result suggests that aluminum (with fine holes drilled through them) can be easily anodized. With its ability to remove heat from the contact area via cut portion (removing the oxide layer) of the material, aluminum is a potential material to be used to spear head the next generation of interposer with less instability in the dimensional accuracy of these test sockets.

Acknowledgments

This research work is funded through the Faculty Research Grant and Undergraduate Research Scholar Award. Lucas Machado's research time at Andrews University was sponsored by the Brazil Scientific Mobility Program.

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Oct 30th, 3:45 PM Oct 30th, 4:00 PM

C-4 Evaluation of anodized aluminum for potential use as an interposer for the test socket industry

Interposers are used to position (helical springs) pins used to analyze the connectivity of the printed circuit board. The interlocking plates are made of polymers, an electric insulator to prevent the short circuiting of the electronics as well as for ease of manufacturability. But the dimensional accuracy of these polymers may be hampered by the increase in temperature during operation. A new material that has the ease of manufacturability and is a good insulator, but will not be hampered by the increase in temperature, is desired. Aluminum with its surface coated with an oxide layer (aluminum oxide) would fulfill this criterion.

Pieces of aluminum alloy 6061, (~1 inch x 1 inch) with fine holes (0.5 mm or less) drilled into the thin sheet (0.01 in) were anodized in the lab. The resistance of these anodized material measured were very high (overload) and an oxide thickness of ~4 microns was determined using the scanning electron microscope.

This result suggests that aluminum (with fine holes drilled through them) can be easily anodized. With its ability to remove heat from the contact area via cut portion (removing the oxide layer) of the material, aluminum is a potential material to be used to spear head the next generation of interposer with less instability in the dimensional accuracy of these test sockets.